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CLAWS III-N RF Integration Engineer

North Carolina State University at Raleigh Raleigh, NC

  1. Salary Not stated by the employer
  2. Employer North Carolina State University at Raleigh
  3. Location Raleigh, NC
  4. Workplace On site
  5. Role Staff
  6. Posted Mar 24, 2026
  7. Reference pa-228712
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CLAWS III-N RF Integration Engineer at North Carolina State University at Raleigh, Raleigh, NC
We are seeking a highly skilled RF Integration Engineer to join our team and contribute to the development of next-generation RF semiconductor devices. The ideal candidate will have expertise in semiconductor process integration, device and amplifier design, electrical characterization, and device simulation.
Key Responsibilities
  • RF Device Design and Development (30%)
    • Design and optimize GaN RF devices including discrete HEMTs, passive elements, and MMICs.
    • Establish a flexible PDK defining the CLAWS RF technologies.
    • Utilize TCAD simulation (e.g., Synopsys, Silvaco, etc.) for process and device modeling, electrical characteristics prediction, and performance enhancement.
    • Develop and refine device layouts for wafer fabrication, ensuring manufacturability and reliability.
  • Process Integration and Fabrication (30%)
    • Be responsible for process development and integration enabling the fabrication of GaN devices leveraging NCSU’s nanofabrication facilities.
    • Establish hands-on proficiency in relevant fabrication methods, including lithography, metal and dielectric deposition, etching, wafer dicing, and others as needed.
  • Characterization and Reliability Testing (20%)
    • Define and execute device on-wafer and packaged device characterization plans that include DC, small signal RF, load-pull tests.
    • Utilize model extraction tools (e.g., IC-CAP) to generate compact models and from electrical test data.
    • Leverage failure analysis and characterization methods to support process development and integration.
    • Analyze reliability metrics to assess long-term device stability.

  • Cross-Functional Collaboration (20%)
    • Work with process engineers and R&D partners to drive technology improvements.
    • Collaborate with circuit designers, applications engineers, and product development teams to translate device-level improvements into system-level advantages.
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