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CLAWS III-N Power Integration Engineer

North Carolina State University at Raleigh Raleigh, NC

  1. Salary Not stated by the employer
  2. Employer North Carolina State University at Raleigh
  3. Location Raleigh, NC
  4. Workplace On site
  5. Role Staff
  6. Posted Oct 1, 2025
  7. Reference pa-223547
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CLAWS III-N Power Integration Engineer at North Carolina State University at Raleigh, Raleigh, NC
We are seeking a highly skilled Wide-Bandgap Power Device Engineer to join our team and contribute to the development of next-generation power semiconductor devices. The ideal candidate will have expertise in semiconductor process integration, power device design (diodes, FETs, etc.), electrical characterization, and device simulation to drive innovation in high-efficiency, high-performance wide-bandgap power solutions.

Key Responsibilities
  • Power Device Design & Development (30%)
    • Design and optimize GaN power devices (HEMTs, Diodes, lateral/vertical FETs) for high-voltage and high-frequency applications.
    • Utilize TCAD simulation (e.g., Synopsys, Silvaco, etc.) for process and device modeling, electrical characteristics prediction, and performance enhancement.
    • Develop and refine device layouts for wafer fabrication, ensuring manufacturability and reliability.
  • Process Integration & Fabrication (30%)
    • Work to define and optimize GaN-on GaN, GaN-on-Si, GaN-on-SiC, and other heteroepitaxial structures for power applications.
    • Lead the wafer process flow development, including epi structures, etching, metallization, and passivation steps.
    • Troubleshoot process integration challenges related to defectivity, yield, and reliability.
  • Electrical Characterization & Reliability Testing (20%)
    • Define and execute device characterization plans (IV, CV, breakdown, leakage, switching performance).
    • Analyze reliability metrics such as TDDB, HTRB, HTOL, and step-stress testing to assess long-term device stability.
    • Interface with packaging and application engineers to optimize thermal management and electrical performance in real-world applications.
  • Cross-functional Collaboration (20%)
    • Work with process engineers and R&D partners to drive technology improvements.
    • Collaborate with circuit designers, applications engineers, and product development teams to translate device-level improvements into system-level advantages.
    • Stay up to date with emerging GaN technology trends, competitive landscape, and industry benchmarks.
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